SK Hynix Announces $12.9 Billion Investment in Advanced Memory Chip Plant Amid AI Boom
SK Hynix unveiled plans to invest $12.9 billion in a cutting-edge memory chip packaging facility in Cheongju, South Korea. Construction begins in April 2026, with operations slated for late 2027. The plant will specialize in high-bandwidth memory (HBM) packaging, stacking multiple chips into compact, energy-efficient units to meet surging AI processor demands.
The HBM market is forecast to grow 33% annually through 2030 as AI workloads escalate. DRAM prices are already reacting, projected to spike 50-55% this quarter as manufacturers pivot production toward AI-optimized memory. SK Hynix currently dominates the HBM sector with 61% market share, outpacing rivals Samsung and Micron.
This strategic MOVE underscores how traditional semiconductor giants are racing to capitalize on AI-driven infrastructure needs. The investment reflects confidence in sustained demand for high-performance memory solutions as generative AI models grow more complex and resource-intensive.